1. Choose your Affinity Group

* Equal Opportunity / Affirmative Action

We serve Equal Opportunity Employers and are an Equal Opportunity Employer. The Professional Diversity Network has separate professional networking sites for different affinities, and in selecting the groups you identify with, you will be joined with those networks.

Note: Providing this information is strictly voluntary - you will not be penalized or subjected to adverse treatment. If you choose not to provide this information, simply select "Choose not to identify."

2. Choose Method
Sign in with LinkedIn
Sign in with Facebook

Tell us about yourself

Senior Signal Integrity Engineer
at Micron
Boise, ID

Senior Signal Integrity Engineer
at Micron
Boise, ID

Save or bookmark jobs as you go and access them anytime later with your account.




Req. ID: 139320 


Micron Technology’s vision is to transform how the world uses information to enrich life and our dedication to people, innovation, tenacity, teamwork, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

The Signal Integrity Research and Development (SI R&D) team supports all of Micron’s current and future product developments. Major product technologies developed at Micron include DRAM, LPDRAM, Graphics DRAM, NAND, NOR, 3DX within the Computing, Networking, Mobile, Storage, Server and Embedded product groups. A major SI R&D team focus is memory module designs. The team owns all steps of the SI/PI analysis and optimization for memory modules (DIMMs) in a system environment. The team also supports future specification development within several industry standards groups including JEDEC and ONFI. The group working environment is diverse, challenging, and team oriented.

As an expert Signal Integrity Engineer at Micron Technology, Inc., you would be responsible for analyzing and optimizing memory modules. You would be responsible for performing SI/PI analysis on all DDR4 and DDR5 DIMMs. You will guide layout and part placement on memory modules to provide optimum routing solutions with good electrical performance that meet System Integration requirements.

You will be responsible for representing the SI R&D team and integrating with package design, silicon design, product engineering, and marketing departments to ensure overall product performance. You will also be expected to contribute to future standards development efforts through system and product electrical capability exploration. Additional responsibilities include external customer support and group methodology development.


Successful candidates for this position will have:

  • BSEE w/ 5 years relevant industry experience (or equivalent degrees) or MSEE w/2 years of experience.
  • Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience.
  • Required experience and working knowledge of PCB board level simulation tools like Cadence System SI, Speed 2000, Power SI, Specctraquest, Sigxp etc.
  • Required experience and working knowledge of 3D E.M. field solvers, time and frequency domain simulation tools like SIwave, HFSS, HSPICE, ADS, etc.
  • Proven understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single ended interface technologies.
  • Expert and knowledgeable of Printed Circuit Board (PCB) layout or electrical package design techniques.
  • Familiarity with high speed interfaces such as PCIe, SATA, SAS, DDR3/4/5, LPDDR2/3/4 and ONFI standards.
  • Familiarity with HVM corner cases and statistical analysis and equivalent tools (example: JMP) is also helpful
  • Familiarity and fundamental understanding of lab measurement equipment
  • Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
  • Ambitious - candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal communication skills, and have the ability to work well in a diverse team environment.

About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || Experienced || Regular || Engineering || #LI-RS1 || Tier 4 || 

Similar Jobs

See All »

Other Jobs at Micron

See All »